Embedded and immersed heat pipes in automated driving system computers

ABSTRACT

Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

TECHNICAL FIELD

The present disclosure generally relates to thermal management forautomated driving system computers.

BACKGROUND

An autonomous vehicle is a motorized vehicle that can navigate without ahuman driver. An exemplary autonomous vehicle can include varioussensors, such as a camera sensor, a light detection and ranging (LIDAR)sensor, and a radio detection and ranging (RADAR) sensor, amongstothers. The sensors collect data and measurements that the autonomousvehicle can use for operations such as navigation. The sensors canprovide the data and measurements to an automated driving systemcomputer (ADSC) of the autonomous vehicle, which can use the data andmeasurements to control a mechanical system of the autonomous vehicle,such as a vehicle propulsion system, a braking system, or a steeringsystem. Typically, the ADSC is a high performance computing system witha wide array of electronic and compute components and systems that worktogether to perform a number of complex operations for the autonomousvehicle and control various systems on the autonomous vehicle.

While high performance computing systems are available in consumer andenterprise applications, such computing systems are not equipped tohandle the harsh and often unpredictable operating conditions ofvehicles. For example, autonomous vehicles and internal components ofautonomous vehicles, such as ADSCs, can experience a variety of harshand often hazardous environmental and operating conditions such asextreme temperatures (e.g., extreme hot and/or cold temperatures),extreme temperature fluctuations, weather elements (e.g., wind, rain,snow, ice, humidity, etc.), potentially harmful environmental particlesor matter (e.g., dust, dirt, grease, etc.), damaging forces (e.g.,shock, vibrations, impacts, collisions, etc.), water, rough terrains,and other harsh or hazardous environmental and operating conditions.

In the autonomous vehicle context, thermal management of electronic andcompute components and systems in ADSCs is particularly challenging aselectronic and compute components are vulnerable to, and generallyill-suited to handle, the harsh and extreme weather and temperatureconditions experienced by autonomous vehicles. Indeed, the electronicand compute components available can succumb to the harsh and extremeweather and temperature conditions experienced in the operational domainof autonomous vehicles. What is needed in the art is thermal managementtechnologies that enable ADSCs and internal ADSC components to manageand withstand the difficult conditions experienced in the operationaldomain of autonomous vehicles.

BRIEF DESCRIPTION OF THE DRAWINGS

The various advantages and features of the present technology willbecome apparent by reference to specific implementations illustrated inthe appended drawings. A person of ordinary skill in the art willunderstand that these drawings only show some examples of the presenttechnology and would not limit the scope of the present technology tothese examples. Furthermore, the skilled artisan will appreciate theprinciples of the present technology as described and explained withadditional specificity and detail through the use of the accompanyingdrawings in which:

FIG. 1 illustrates an example autonomous vehicle environment including acomputing system in communication with an autonomous vehicle;

FIG. 2 is a schematic diagram illustrating an example configuration ofan autonomous driving system computer that can be implemented in anautonomous vehicle, in accordance with some examples;

FIGS. 3 through 7 are schematic diagrams illustrating exampleconfigurations of an enhanced cold plate that uses heat pipes forthermal management and can be implemented in an autonomous drivingsystem computer, in accordance with some examples;

FIGS. 8 through 12 are schematic diagrams illustrating exampleconfigurations of an enhanced cold plate that uses vapor chamber forthermal management and can be implemented in an autonomous drivingsystem computer, in accordance with some examples;

FIGS. 13A and 13B are diagrams illustrating example heat managementflows in example enhanced cold plates for an autonomous driving systemcomputer, in accordance with some examples;

FIGS. 14 and 15 illustrate example methods for thermal management usingenhanced cold plates for automated driving system computers, inaccordance with some examples; and

FIG. 16 illustrates an example computing system architecture forimplementing various aspects of the present technology.

DETAILED DESCRIPTION

Various examples of the present technology are discussed in detailbelow. While specific implementations are discussed, it should beunderstood that this is done for illustration purposes only. A personskilled in the relevant art will recognize that other components andconfigurations may be used without parting from the spirit and scope ofthe present technology. In some instances, well-known structures anddevices are shown in block diagram form in order to facilitatedescribing one or more aspects. Further, it is to be understood thatfunctionality that is described as being carried out by certain systemcomponents may be performed by more or fewer components than shown.

The disclosed technologies address a need in the art for improvedthermal management strategies for automated driving system computers(ADSCs) and ADSC compute and electronic components. As previouslyexplained, autonomous vehicles and ADSCs can experience a variety ofharsh and often hazardous environmental and operating conditions such asextreme temperatures, extreme temperature fluctuations, weather elements(e.g., wind, rain, snow, ice, humidity, etc.), harmful environmentalparticles or matter (e.g., dust, dirt, grease, etc.), damaging forces(e.g., shock, vibrations, impacts, collisions, etc.), water, roughterrains, and other harsh or hazardous environmental and operatingconditions. As a result, thermal management of electronic and computecomponents in ADSCs can be very challenging as electronic and computecomponents are vulnerable to, and generally ill-suited to handle, theharsh and extreme weather and temperature conditions experienced byautonomous vehicles.

The approaches herein can provide thermal management strategies andtechnologies that can enable ADSCs and internal ADSC components (e.g.,internal electronic and compute components) to handle and withstand thedifficult conditions experienced in the operational domain of autonomousvehicles. In some examples, the approaches herein can implement enhancedcold plates in ADSCs designed to provide enhanced thermal managementbenefits to internal components in the ADSCs and can allow the internalcomponents to handle and withstand harsh and extreme weather,temperature, and other environmental conditions experienced by ADSCs inautonomous vehicles.

In the following disclosure, systems and methods are provided forthermal management in ADSCs and associated compute and electroniccomponents. The present technologies will be described in the followingdisclosure as follows. The discussion begins with a description ofexample autonomous vehicle environments and systems, technologies andtechniques for thermal management of ADSCs and ADSC internal components,as illustrated in FIGS. 1 through 12. A description of example flows andmethods for thermal management of ADSCs and ADSC internal components, asillustrated in FIGS. 13A through 15, will then follow. The discussionconcludes with a description of an example computing devicearchitecture, including example hardware components that can beimplemented in ADSCs, as illustrated in FIG. 16. The disclosure nowturns to FIG. 1.

FIG. 1 illustrates an example autonomous vehicle environment 100. Theexample autonomous vehicle environment 100 includes an autonomousvehicle 102, a remote computing system 150, and a ridesharingapplication 170. The autonomous vehicle 102, remote computing system150, and ridesharing application 170 can communicate with each otherover one or more networks, such as a public network (e.g., a publiccloud, the Internet, etc.), a private network (e.g., a local areanetwork, a private cloud, a virtual private network, etc.), and/or ahybrid network (e.g., a multi-cloud or hybrid cloud network, etc.).

The autonomous vehicle 102 can navigate about roadways without a humandriver based on sensor signals generated by sensors 104-108 on theautonomous vehicle 102. The sensors 104-108 on the autonomous vehicle102 can include one or more types of sensors and can be arranged aboutthe autonomous vehicle 102. For example, the sensors 104-108 caninclude, without limitation, one or more inertial measuring units(IMUs), one or more image sensors (e.g., visible light image sensors,infrared image sensors, video camera sensors, surround view camerasensors, etc.), one or more light emitting sensors, one or more globalpositioning system (GPS) devices, one or more radars, one or more lightdetection and ranging sensors (LIDARs), one or more sonars, one or moreaccelerometers, one or more gyroscopes, one or more magnetometers, oneor more altimeters, one or more tilt sensors, one or more motiondetection sensors, one or more light sensors, one or more audio sensors,etc. In some implementations, sensor 104 can be a radar, sensor 106 canbe a first image sensor (e.g., a visible light camera), and sensor 108can be a second image sensor (e.g., a thermal camera). Otherimplementations can include any other number and type of sensors.

The autonomous vehicle 102 can include several mechanical systems thatare used to effectuate motion of the autonomous vehicle 102. Forinstance, the mechanical systems can include, but are not limited to, avehicle propulsion system 130, a braking system 132, and a steeringsystem 134. The vehicle propulsion system 130 can include an electricmotor, an internal combustion engine, or both. The braking system 132can include an engine brake, brake pads, actuators, and/or any othersuitable componentry configured to assist in decelerating the autonomousvehicle 102. The steering system 134 includes suitable componentryconfigured to control the direction of movement of the autonomousvehicle 102 during navigation.

The autonomous vehicle 102 can include a safety system 136. The safetysystem 136 can include lights and signal indicators, a parking brake,airbags, etc. The autonomous vehicle 102 can also include a cabin system138, which can include cabin temperature control systems, in-cabinentertainment systems, etc.

The autonomous vehicle 102 can include an automated driving systemcomputer (ADSC) 110 in communication with the sensors 104-108 and thesystems 130, 132, 134, 136, and 138. The ADSC 110 can include one ormore internal computers and/or computing systems. Moreover, the ADSC 110can include one or more compute components or processors such as, forexample, one or more central processing units (CPUs), one or moregraphics processing units (GPUs), one or more digital signal processors(DSPs), one or more image signal processors (ISPs), one or moreIntellectual Property (IP) cores, one or more microprocessors, etc. TheADSC 110 can also include one or more hardware components and/orelectronic circuits such as, for example, one or more field-programmablegate arrays (FPGAs), one or more application-specific integratedcircuits (ASICs), one or more storage devices, one or more memorydevices, one or more communications devices (e.g., network interfacecard (NIC), wireless NIC, antenna, etc.), one or more sensors (e.g.,image or camera sensor, radar sensor, LIDAR sensor, etc.), one or moreGPS devices, etc.

In some examples, the ADSC 110 includes one or more processors and atleast one memory for storing instructions executable by the one or moreprocessors. The computer-executable instructions can make up one or moreservices for controlling the autonomous vehicle 102, communicating withremote computing system 150, receiving inputs from passengers or humanco-pilots, logging metrics regarding data collected by sensors 104-108and human co-pilots, etc.

In some cases, the ADSC 110 can include a control service 112 configuredto control operation of the vehicle propulsion system 130, the brakingsystem 132, the steering system 134, the safety system 136, and thecabin system 138. The control service 112 can receive sensor signalsfrom the sensors 104-108 can communicate with other services of the ADSC110 to effectuate operation of the autonomous vehicle 102. In someexamples, control service 112 may carry out operations in concert withone or more other systems of autonomous vehicle 102.

In some cases, the ADSC 110 can also include a constraint service 114 tofacilitate safe propulsion of the autonomous vehicle 102. The constraintservice 114 includes instructions for activating a constraint based on arule-based restriction upon operation of the autonomous vehicle 102. Forexample, the constraint may be a restriction on navigation that isactivated in accordance with protocols configured to avoid occupying thesame space as other objects, abide by traffic laws, circumvent avoidanceareas, etc. In some examples, the constraint service 114 can be part ofthe control service 112.

The ADSC 110 can also include a communication service 116. Thecommunication service 116 can include software and/or hardware elementsfor transmitting and receiving signals to and from the remote computingsystem 150. The communication service 116 can be configured to transmitinformation wirelessly over a network, for example, through an antennaarray or interface that provides cellular (long-term evolution (LTE),3^(rd) Generation (3G), 5^(th) Generation (5G), etc.) communication.

In some examples, one or more services of the ADSC 110 are configured tosend and receive communications to remote computing system 150 forreporting data for training and evaluating machine learning algorithms,requesting assistance from remote computing system 150 or a humanoperator via remote computing system 150, software service updates,ridesharing data, etc.

The ADSC 110 can also include a latency service 118. The latency service118 can utilize timestamps on communications to and from the remotecomputing system 150 to determine if a communication has been receivedfrom the remote computing system 150 in time to be useful. For example,when a service of the ADSC 110 requests feedback from remote computingsystem 150 on a time-sensitive process, the latency service 118 candetermine if a response was timely received from remote computing system150, as information can quickly become too stale to be actionable. Whenthe latency service 118 determines that a response has not been receivedwithin a threshold period of time, the latency service 118 can enableother systems of autonomous vehicle 102 or a passenger to make decisionsor provide needed feedback.

The ADSC 110 can also include a user interface service 120 that cancommunicate with cabin system 138 to provide information or receiveinformation to a human co-pilot or passenger. In some examples, a humanco-pilot or passenger can be asked or requested to evaluate and overridea constraint from constraint service 114. In other examples, the humanco-pilot or passenger may wish to provide an instruction to theautonomous vehicle 102 regarding destinations, requested routes, orother requested operations.

As described above, the remote computing system 150 can be configured tosend and receive signals to and from the autonomous vehicle 102. Thesignals can include, for example and without limitation, data reportedfor training and evaluating services such as machine learning services,data for requesting assistance from remote computing system 150 or ahuman operator, software service updates, rideshare data, commands orinstructions, statistics, navigation data, vehicle data, etc.

The remote computing system 150 can include an analysis service 152configured to receive data from autonomous vehicle 102 and analyze thedata to train or evaluate machine learning algorithms for operating theautonomous vehicle 102. The analysis service 152 can also performanalysis pertaining to data associated with one or more errors orconstraints reported by autonomous vehicle 102.

The remote computing system 150 can also include a user interfaceservice 154 configured to present metrics, video, images, soundsreported from the autonomous vehicle 102 to an operator of remotecomputing system 150, maps, routes, navigation data, notifications, userdata, vehicle data, software data, and/or any other content. Userinterface service 154 can receive, from an operator, input instructionsfor the autonomous vehicle 102.

The remote computing system 150 can also include an instruction service156 for sending instructions regarding the operation of the autonomousvehicle 102. For example, in response to an output of the analysisservice 152 or user interface service 154, instructions service 156 canprepare instructions to one or more services of the autonomous vehicle102 or a co-pilot or passenger of the autonomous vehicle 102.

The remote computing system 150 can also include a rideshare service 158configured to interact with ridesharing applications 170 operating oncomputing devices, such as tablet computers, laptop computers,smartphones, head-mounted displays (HMDs), gaming systems, servers,smart devices, smart wearables, and/or any other computing devices. Insome cases, such computing devices can be passenger computing devices.The rideshare service 158 can receive from passenger ridesharing app 170requests, such as user requests to be picked up or dropped off, and candispatch autonomous vehicle 102 for a requested trip.

The rideshare service 158 can also act as an intermediary between theridesharing app 170 and the autonomous vehicle 102. For example,rideshare service 158 can receive from a passenger instructions for theautonomous vehicle 102, such as instructions to go around an obstacle,change routes, honk the horn, etc. The rideshare service 158 can providesuch instructions to the autonomous vehicle 102 as requested.

The remote computing system 150 can also include a package service 162configured to interact with the ridesharing application 170 and/or adelivery service 172 of the ridesharing application 170. A useroperating ridesharing application 170 can interact with the deliveryservice 172 to specify information regarding a package to be deliveredusing the autonomous vehicle 102. The specified information can include,for example and without limitation, package dimensions, a packageweight, a destination address, delivery instructions (e.g., a deliverytime, a delivery note, a delivery constraint, etc.), and so forth.

The package service 162 can interact with the delivery service 172 toprovide a package identifier to the user for package labeling andtracking. Package delivery service 172 can also inform a user of whereto bring their labeled package for drop off. In some examples, a usercan request the autonomous vehicle 102 come to a specific location, suchas the user's location, to pick up the package. While delivery service172 has been shown as part of the ridesharing application 170, it willbe appreciated by those of ordinary skill in the art that deliveryservice 172 can be its own separate application.

One beneficial aspect of utilizing autonomous vehicle 102 for bothridesharing and package delivery is increased utilization of theautonomous vehicle 102. Instruction service 156 can continuously keepthe autonomous vehicle 102 engaged in a productive itinerary betweenrideshare trips by filling what otherwise would have been idle time withproductive package delivery trips.

FIG. 2 is a schematic diagram illustrating an example configuration ofADSC 110. In this example, the ADSC 110 includes a chassis 210 forhousing, stabilizing and protecting internal components of the ADSC 110.In some cases, the chassis 210 can be a rugged enclosure designed fordurability and the capacity to withstand extended use in harsh and/orunpredictable environments. For example, autonomous vehicles and theinternal components of autonomous vehicles can experience a variety ofenvironmental conditions such as, for example, extreme temperatures(e.g., extreme cold and hot temperatures), temperature fluctuations,wind, water and humidity, dust, dirt, grease, snow, ice, vibrations,shock, impacts, collisions, rough terrains, and other environmentalhazards and conditions. Thus, the chassis 210 can be designed tostabilize the internal components of the ADSC 110 and protect them fromsuch harsh conditions and environments.

The chassis 210 can house and stabilize computing components 202A-N(collectively “202”), one or more enhanced cold plates 200 used toprovide thermal management for the computing components 202, and one ormore power electronics components 212, such as a power supply, forsupplying power to the computing components 202.

In some examples, some or all of the computing components 202 can bedirectly or indirectly mounted or coupled to the one or more enhancedcold plates 200. In other examples, some or all of the computingcomponents 202 can be mounted on, or coupled to, one or more structuresand/or boards, such as printed circuit boards (PCBs), which can bedirectly or indirectly coupled to the one or more enhanced cold plates200.

The computing components 202 can include, for example and withoutlimitation, one or more storage devices, one or more CPUs, one or moreGPUs, one or more DSPs, one or more ISPs, one or more FPGAs, one or moreASICs, one or more controllers, one or more power electronics, one ormore sensors, one or more memory devices (e.g., RAM, ROM, cache, and/orthe like), one or more networking interfaces (e.g., wired and/orwireless communications interfaces and the like), and/or otherelectronic circuits or hardware, processing devices, computer software,firmware, or any combination thereof. As further described herein, theone or more enhanced cold plates 200 can include, for example andwithout limitation, one or more heat pipes, one or more vapor chambers,one or more fans, one or more fluid channels or tubes, one or more airchannels, one or more heat sinks, one or more heat spreaders, one ormore heat exchangers, one or more pumps, one or more reservoirs, one ormore condensers, and/or one or more thermal management components orfeatures.

In some examples, the one or more enhanced cold plates 200 can include asingle enhanced cold plate. In other examples, the one or more enhancedcold plates 200 can include multiple enhanced cold plates. For example,in some cases, the chassis 210 can house a series, stack, cluster, orset of layers of enhanced cold plates used to provide thermal managementfor the computing components 202. Moreover, the size and number ofenhanced cold plates 200 implemented for the ADSC 110 can vary based onone or more factors such as, for example, thermal managementrequirements, number and/or type of electronic components (e.g.,computing components 202, etc.) in the ADSC 110, power requirementsassociated with the ADSC 110, size and/or shape of the ADSC 110, typeand/or characteristics of the autonomous vehicle 102 where the ADSC 110is deployed, performance requirements associated with the ADSC 110,space considerations, environmental factors, and/or any other factorsthat can impact the power, thermal, space, performance, and/orconfiguration requirements associated with the ADSC 110.

In some examples, the chassis 210 can also house one or more othercomponents such as, for example and without limitation, one or morefans, one or more heat sinks, one or more heat spreaders, one or moreheat exchangers, one or more pumps, one or more reservoirs, one or morecondensers, one or more thermal management components or features, oneor more cables or wires, one or more interfaces, one or more controlsystems, other electronic circuits, other electronic hardware,tubing/pipes, etc. An illustrative example of computing device andhardware components that can be implemented by the ADSC 110 and housedby the chassis 210 are described below with respect to FIG. 16.

While the ADSC 110 is shown to include certain components, one ofordinary skill will appreciate that the ADSC 110 can include more orfewer components than those shown in FIG. 2. The components andarrangement of components shown in FIG. 2 are provided as illustrativeexamples for clarity and explanation purposes.

FIG. 3 is a schematic diagram illustrating an example configuration 300of an enhanced cold plate 200 that can be implemented in the ADSC 110.The enhanced cold plate 200 can provide various thermal managementfeatures and benefits for the computing components 202A-N of the ADSC110. As previously explained, in some cases, the computing components202A-N can be directly or indirectly mounted or coupled to the enhancedcold plate 200 and, in other cases, the computing components 202A-N canbe mounted or coupled to one or more structures and/or boards, such asPCBs, which can be directly or indirectly coupled to the enhanced coldplate 200.

In the example configuration 300 shown in FIG. 3, the enhanced coldplate 200 includes heat pipes 310A-B (collectively “310”) and a fluidchannel 320 for removing, transferring and/or dissipating heat away fromthe computing components 202A-N. The heat pipes 310 can be at leastpartly embedded in or coupled to the enhanced cold plate 200. In someexamples, the heat pipes 310A and/or the heat pipes 310B can include asingle heat pipe. In other examples, the heat pipes 310A and/or the heatpipes 310B can include multiple heat pipes. Moreover, the heat pipes310A and the heat pipes 310B can include a same or different number,size, shape, and/or configuration of heat pipes. In some cases, theenhanced cold plate 200 can include more or less heat pipes 310 thanshown in FIG. 3.

The heat pipes 310 are heat-transfer or dissipation components thatimplement thermal conductivity and phase transition to transfer heatfrom one location to another. Each of the heat pipes 310 can have liquidinside for transferring heat from a hot interface or area of the heatpipe to a different interface or area (e.g., a colder interface or area)of the heat pipe. The hot interface or area of the heat pipe can absorbor collect heat from one or more of the computing components 202A-N, andthe different interface or area of the heat pipe can be further awayfrom the one or more of the computing components 202A-N than the hotinterface or area of the heat pipe. Thus, by transferring the heat fromthe hot interface or area of the heat pipe to the different interface orarea, the heat pipe can transfer heat away from such computingcomponents, thereby providing cooling and thermal management benefits tothe computing components.

For example, the liquid in each heat pipe can evaporate into a gas as itabsorbs heat from a heat source, such as heat from one or more of thecomputing components 202A-N. The gas can travel along the heat pipe tothe colder interface or area of the heat pipe, moving the heat away fromthe heat source and the hot interface or area of the heat pipe. The gascan then condense back into a liquid and release the latent heat. Theliquid then returns to the hot interface or area through capillaryaction, centrifugal force, or gravity, at which point the cycle canrepeat.

The type of liquid in the heat pipes 310 can vary based on one or morefactors and/or considerations. As previously mentioned, in the contextof autonomous vehicles (e.g., 102), the environmental conditions and theconditions surrounding the ADSC 110 can vary and are often harsh orextreme. Thus, the properties of the liquid implemented with the heatpipes 310 can affect the performance of the liquid in the heat pipes310. For example, depending on various factors environmental,implementation, and surround factors and conditions, certain liquids canlead to poor heat transfer, clogging, corrosion, and even systemfailure, while other liquids may have better heat transfer performance,may not clog, may limit or avoid corrosion, and may reduce thelikelihood of system failure.

Accordingly, the type of liquid used in the heat pipes 310 can beselected based on the properties of the liquid and the environmental,implementation, and surround conditions in which the heat pipes 310operate. For example, the liquid can be selected based on the propertiesof the liquid and the temperature in which the heat pipes 310 willoperate. Non-limiting examples of factors of a liquid that can beconsidered when selecting a liquid can include the liquid'scompatibility with the system's metals and/or the heat pipes 310, theliquid's thermal conductivity and specific heat, the liquid's viscosity,the liquid's freezing point, the liquid's flash point, the liquid'scorrosivity, the liquid's toxicity, the liquid's thermal stability, etc.In some examples, the type of liquid selected can be a liquid determinedto have compatibility with the system's metals and/or the heat pipes310, high thermal conductivity and specific heat, low viscosity, a lowfreezing point, a high flash point, low corrosivity, low toxicity,and/or thermal stability.

In some examples, the liquid used in the heat pipes 310 can be water. Inother examples, the liquid used in the heat pipes 310 can be glycol.Moreover, non-limiting examples of other liquids can include de-ionizedwater, dielectric fluids, alcohol (e.g., methanol, ethanol, etc.),mercury, ammonia, water/glycol, Freon, alkali metals (e.g., cesium,potassium, sodium), refrigerant R134a, etc. In some cases, the sameliquid can used in all of the heat pipes 310. In other cases, differentheat pipes can have different types of liquids, which can vary or can beselected based on the one or more factors previously explained.

In addition to having a working fluid, each of the heat pipes 310 canhave a wick structure that can exert a capillary action on the liquidphase of the working fluid and a case (e.g., a sealed pipe or envelope)which can house the wick structure, the working fluid, and any otherinternal elements of the heat pipe. The case and wick structure can bedesigned to be compatible with the working fluid. Moreover, thematerials used to construct the case and wick structure can be selectedbased on some or all of the environmental, implementation, and surroundfactors previously described. Non-limiting example materials that can beused for the case include copper, aluminum, superalloys, etc. Moreover,non-limiting examples of wick structures include a sintered powder wick,a screen mesh wick, a grooved wick, etc.

In some examples, the configuration (e.g., size, length, shape,thickness, structure, etc.) of the case and wick can also vary based onone or more factors such as, for example, the type of working fluid, thecharacteristics (e.g., layout, size, shape, materials, etc.) of theenhanced cold plate 200, the layout of the computing components 202A-N,the desired heat carrying capacity of the heat pipes 310, the typeand/or number of computing components 202A-N, the environmental andsurrounding conditions where the heat pipes 310 will operate,performance requirements or factors associated with the computingcomponents 202A-N, and/or any other constraints that can influence theperformance, stability, cost, etc., of the heat pipes 310. In someexamples, the configuration of the case and wick can depend on anyconstrains created by the characteristics of the enhanced cold plate200, the layout of the computing components 202A-N, and/or a desiredmaximum power handling or heat carrying capacity (Qmax) of the heatpipes 310.

The Qmax (e.g., the maximum capacity of power that can be handled ortransferred from one point to another) can be affected by variousfactors such as, for example, the diameter of the heat pipes 310, theshape (e.g., flatness, roundness, curvature, amount of bending, etc.) ofthe heat pipes 310, the size or length of the heat pipes 310, thematerial of the casing of the heat pipes 310, the material of the wickin the heat pipes 310, the thickness of the wick, the porosity of thewick, the amount of working fluid, the type of working fluid, etc. Insome examples, the Qmax of the heat pipes 310 can be optimized or tunedfor specific operating parameters and performance characteristics bychanging the internal structure of the heat pipes 310 (e.g., wickporosity, wick thickness, etc.), the physical characteristics of theheat pipes 310 (e.g., the size, shape, bending, flattening, diameter,material or composition, etc.), the composition and/or materials of theheat pipes 310, etc.

The number of heat pipes 310 implemented in the enhanced cold plate 200can vary in different examples. The number of heat pipes 310 can beselected based on one or more factors such as, for example, the numberand/or type of computing components 202A-N associated with the enhancedcold plate 200, the performance requirements of the ADSC 110 and/or thecomputing components 202A-N, heat and power conditions associated withthe ADSC 110 and computing components 202A-N, stability considerationsassociated with the ADSC 110 and computing components 202A-N, theconfiguration (e.g., size, shape, thickness, length, structure, etc.) ofthe enhanced cold plate 200, environmental factors, the layout of thecomputing components 202A-N, the configuration of each of the heat pipes310, the Qmax characteristics of the heat pipes 310, etc. Moreover, thelayout, arrangement, position, and/or shape of the heat pipes 310 canalso vary based on one or more factors, as further described herein.

As previously mentioned, in addition to including heat pipes 310, theenhanced cold plate 200 can include a fluid channel 320 for removing,transferring, dissipating, etc., heat away from the computing components202A-N. Moreover, the fluid channel 320 can also remove, transfer,dissipate, etc., heat transferred or collected from the heat pipes 310,as further explained herein. The fluid channel 320 can include a fluidthat can flow from a fluid ingress point 322A to a fluid egress point322B. The fluid ingress point 322A and fluid egress point 322B caninclude ports where the fluid enters and exits the fluid channel 320,interfaces connecting the fluid channel 320 with tubes, hoses, or pipesthat supply the fluid to the fluid channel 320 or points where a tube,hose or pipe of the fluid channel 320 enters and exits the enhanced coldplate 200 from and to a different location on the ADSC 110 (e.g., fromand to a different enhanced cold plate, from and to a reservoir, fromand to a pump, etc.), etc.

The fluid in the fluid channel 320 can be the same type of fluid as theworking fluid in the heat pipes 310 or a different type of fluid. Insome examples, the fluid in the fluid channel 320 can include water. Inother examples, the fluid in the fluid channel 320 can include glycol.In yet other examples, the fluid channel 320 can be used as a channelfor air instead of fluid. The air can be circulated through the fluidchannel 320 to transfer, remove, and/or dissipate heat.

The shape, configuration, layout and placement/positioning of the fluidchannel 320 and the heat pipes 310 can vary in differentimplementations. In the example configuration 300 shown in FIG. 3, theheat pipes 310 have a linear configuration and are coupled to computingcomponents 202A and 202B. As shown, the heat pipes 310A are coupled tocomputing component 202A in order to transfer heat away from thecomputing component 202A, and the heat pipes 310B are coupled tocomputing component 202B in order to transfer heat away from thecomputing component 202B. The computing components 202A and 202B in thisexample can be any of the computing components 202 previously described.For example, the computing components 202A and 202B can be CPUs, GPUs,or any other electronic computing component.

Further, the fluid channel 320 has a u-shape and surrounds the computingcomponents 202A-N. Thus, the fluid in the fluid channel 320 can flowfrom the fluid ingress point 322A, around the computing components202A-N, until exiting at the fluid egress point 322B. As the fluidtravels through the fluid channel 320, the fluid can absorb or collectheat from the computing components 202A-N and carry the heat away fromthe computing components 202A-N until exiting at the fluid egress point322B. Similarly, as the fluid travels by the heat pipes 310A and 310B,the fluid can absorb heat transferred or dissipated from the heat pipes310A and 310B, and transfer the heat away from the heat pipes 310A and310B until exiting at the fluid egress point 322B. This cycle can repeatas fluid continues to flow or circulate around the fluid channel 320,again exiting at the fluid egress point 322B. In this way, the fluidchannel 320 can enhance the cooling or thermal management features ofthe heat pipes 310A and 310B, and vice versa.

In some cases, the fluid channel 320 can include, implement and/orcouple to one or more heat sinks. For example, one or more heat sinkscan be coupled to an internal or external surface of the fluid channel320. The one or more heat sinks can help dissipate heat collected by thefluid channel 320.

While FIG. 3 shows the fluid ingress point 322A located on an end of theenhanced cold plate 200 closer to the computing components 202A-Brelative to the fluid egress point 322B, and the fluid egress point 322Blocated on an end of the enhanced cold plate 200 that is closer to theheat pipes 310A and 310B relative to the fluid ingress point 322A, itshould be noted that this arrangement is merely an example provided forexplanation purposes. In other examples, the fluid ingress point 322Aand/or the fluid egress point 322B can be located elsewhere in theenhanced cold plate 200.

For example, in some cases, the fluid ingress point 322A can be locatedwhere the fluid egress point 322B is currently shown in FIG. 3, and thefluid egress point 322B can be located where the fluid ingress point322A is currently shown in FIG. 3, such that their location is reversedand, as a result, the fluid in the fluid channel 320 flows in theopposite/reverse direction. In another example, the fluid ingress point322A and/or the fluid egress point 322B can be located on a differentside of the enhanced cold plate 200 than shown in FIG. 3 and/ordifferent sides of the enhanced cold plate 200 relative to each other.

FIG. 4 is a schematic diagram illustrating another example configuration400 of the enhanced cold plate 200. In this example, the fluid channel320 has a different shape as the u-shape shown in FIG. 3. In particular,instead of continuing past an outer side of computing component 202C(the side opposite to computing component 202D), the fluid channel 320turns before the computing component 202C and goes around computingcomponents 202C and 202D in a u-shape until returning to an outer sideof computing component 202E (the side opposite to computing components202F and 202G). The fluid channel 320 then continues along the u-shapetrajectory as previously shown in FIG. 3.

This layout of the fluid channel 320 can vary how heat is transferred orcollected from the computing components 202C and 202D. Moreover, thelayout of the fluid channel 320 can take into account specificconstraints or requirements regarding fluid channel coverage, availableor unobstructed space in the enhanced cold plate 200, thelayout/arrangement of components/objects on the enhanced cold plate 200(e.g., computing components 202A-N and/or any other objects orcomponents), thermal management requirements of the ADSC 110 and/or anyof the computing components 202A-N, heat transfer capabilities and/orperformance of the fluid channel 320 and/or the heat pipes 310, and/orany other constraints or factors.

FIG. 5 is a schematic diagram illustrating another example configuration500 of the enhanced cold plate 200. In this example, the locations ofthe fluid ingress point 322A and the fluid egress point 322B arereversed with respect to their locations shown in FIGS. 3 and 4.Consequently, the flow of fluid in the fluid channel 320 has similarlybeen reversed relative to the flow in FIGS. 3 and 4.

In addition, the arrangement of the computing components 202A-N haschanged so that computing component 202C is now partly across fromcomputing component 202A (as opposed to adjacent to computing component202B as shown in FIGS. 3 and 4) and computing component 202D is partlyacross from computing component 202B. To account for the differentarrangement of computing components 202C and 202D and/or providedifferent thermal management properties, the shape of the heat pipes 310has also changed. Here, the heat pipes 310 are shown with a partial bendor curve.

In particular, the heat pipes 310A are now coupled at opposite ends toboth computing components 202A and 202C. Given the arrangement of thecomputing components 202A and 202C, this coupling of the heat pipes 310Ato both of the computing components 202A and 202C is enabled by thepartial bend or curve of the heat pipes 310A. Moreover, this coupling ofthe heat pipes 310A can allow the heat pipes 310A to take heat away fromboth of the computing components 202A and 202C.

Similarly, the heat pipes 310B are now coupled at opposite ends to bothcomputing components 202B and 202D. As previously explained, given thearrangement of the computing components 202B and 202D, this coupling ofthe heat pipes 310B to both of the computing components 202A and 202C isenabled by the partial bend or curve of the heat pipes 310B. Moreover,this coupling of the heat pipes 310B can allow the heat pipes 310B totake heat away from both of the computing components 202B and 202D.

As illustrated in FIG. 5, the shape of the heat pipes 310 can vary toaccount for a specific arrangement of components on the enhanced coldplate 200. The direction of the flow of fluid in the fluid channel 320can also change as needed.

FIG. 6 is a schematic diagram illustrating another example configuration600 of the enhanced cold plate 200. In the example configuration 600,the enhanced cold plate 200 includes a different number of heat pipes310 and the heat pipes 310 have a different shape, size and arrangement.In particular, the enhanced cold plate 200 includes two sets of heatpipes: heat pipe 310A and heat pipe 310B. The heat pipes 310A and 310Bhave an L-shape and are arranged to form a rectangle or square.Moreover, the heat pipes 310A and 310B surround the computing components202A-N such that the computing components 202A-N are contained withinthe rectangle or square formed by the arrangement of the heat pipes 310Aand 310B. The heat pipes 310A and 310B can collect heat from thecomputing components 202A-N and transfer the heat away from thecomputing components 202A-N to provide cooling to the computingcomponents 202A-N.

The enhanced cold plate 200 also includes a fluid channel 320 configuredin a u-shape surrounding the heat pipes 310A and 310B and the computingcomponents 202A-N. The fluid channel 320 can include fluid thatcirculates from the fluid ingress point 322A, around the heat pipes 310Aand 310B and the computing components 202A-N, until exiting through thefluid egress point 322B. As the fluid circulates around the fluidchannel 320, the fluid can collect heat from the heat pipes 310A and310B and transfer the heat away from the heat pipes 310A and 310B (andthe computing components 202A-N) to provide further cooling of thecomputing components 202A-N.

FIG. 7 is a schematic diagram illustrating another example configuration700 of the enhanced cold plate 200. In this example, the enhanced coldplate 200 includes a set of heat pipes 310A arranged parallel oradjacent to computing components 202A and 202B. The set of heat pipes310A can include one or more heat pipes. Moreover, the set of heat pipes310A can dissipate heat away from the computing components 202A and202B.

The enhanced cold plate 200 also includes a heat pipe 310B embedded,contained, or implemented within a fluid channel 320. The heat pipe 310Bcan help dissipate and/or transfer heat away from the computingcomponents 202A-N. Moreover, fluid in the fluid channel 320 can collectheat from the heat pipe 310B and dissipate and/or transfer the heataway. In some examples, the fluid in the fluid channel 320 can also helpdissipate and/or transfer heat away from the computing components202A-N.

The fluid channel 320 in this example has a linear shape and is locatedon an end of the enhanced cold plate 200. Fluid in the fluid channel 320can circulate from a fluid ingress point 322A and around the heat pipe310B until exiting at a fluid egress point 322B. In some examples, thefluid in the fluid channel 320 can surround or engulf the heat pipe 310Bin the fluid channel 320. In some cases, the fluid channel 320 caninclude heat sinks 702, which can help dissipate heat from the heat pipe310B and/or the computing components 202A-N. In some examples, the fluidchannel 320 can include a single heat sink for enhancing thermalmanagement benefits. In other examples, the fluid channel 320 caninclude multiple heat sinks.

In some cases, the heat sinks 702 can be coupled to an exterior surfaceof the fluid channel 320 and/or the enhanced cold plate 200. In otherexamples, the heat sinks 702 can be enclosed within the fluid channel320. Moreover, in some cases, the heat sinks 702 can be directly orindirectly coupled to the heat pipe 310B in the fluid channel 320. Forexample, the heat sinks 702 can be coupled to, and/or in contact with,different portions of the heat pipe 310B.

In some examples, the set of heat pipes 310A can dissipate heat awayfrom the computing components 202A and 202B. The dissipated heat (aswell as heat from the other computing components 202C-N) can movetowards the heat pipe 310B and the fluid channel 320. The heat pipe 310Bcan collect the heat to transfer the heat away from the computingcomponents 202A-N. The fluid in the fluid channel 320 and the heat sinks702 can then further help dissipate and/or transfer the heat away fromthe computing components 202A-N and/or the heat pipe 310B.

While the fluid channel 320 and the heat pipe 310B in the fluid channel320 are shown in FIG. 7 in a linear configuration/shape, it should benoted that such configuration/shape is provided herein as an example forexplanation purposes. In other examples, the enhanced cold plate 200 canimplement one or more fluid channels containing or housing one or moreheat pipes, and the one or more fluid channels and/or the one or moreheat pipes contained or housed in the one or more fluid channels canhave a different size, shape, arrangement, configuration, etc.

Moreover, in some examples, the enhanced cold plate 200 shown in FIGS.3-7 can have other cooling components or combinations of coolingcomponents than those shown in FIGS. 3-7. For example, in some cases,the enhanced cold plate 200 can include a fan in combination with one ormore heat pipes and/or one or more vapor chambers. Exampleconfigurations of the enhanced cold plate 200 that include vaporchambers are shown in FIGS. 8-12 and further described below.

FIG. 8 is a schematic diagram illustrating an example configuration 800of an enhanced cold plate 200 that implements vapor chambers 810A-B(collectively “810”). As illustrated, the enhanced cold plate 200 caninclude the vapor chambers 810 and a fluid channel 820 for removing,transferring and/or dissipating heat away from the computing components202A-N. The vapor chambers 810 can be at least partly embedded in orcoupled to the enhanced cold plate 200. In some examples, the vaporchamber 810A and the vapor chamber 810B can have the same or differentsizes, shapes, and/or configurations. Moreover, in some cases, theenhanced cold plate 200 can include more or less vapor chambers 810 thanshown in FIG. 8.

The vapor chambers 810 are heat-transfer or dissipation components thatimplement thermal conductivity and phase transition to transfer heatfrom one location to another. Each of the vapor chambers 810 can haveliquid inside for transferring heat from a hot interface or area of thevapor chamber to a different interface or area (e.g., a colder interfaceor area) of the vapor chamber. The hot interface or area of the vaporchamber can absorb or collect heat from one or more of the computingcomponents 202A-N, and the different interface or area of the vaporchamber can be further away from the one or more of the computingcomponents 202A-N than the hot interface or area of the vapor chamber.Thus, by transferring the heat from the hot interface or area of thevapor chamber to the different interface or area, the vapor chamber cantransfer heat away from such computing components, thereby providingcooling and thermal management benefits to the computing components.

For example, the liquid in each vapor chamber can evaporate into a gasas it absorbs heat from a heat source, such as heat from one or more ofthe computing components 202A-N. The gas can travel along the vaporchamber to the colder interface or area of the vapor chamber, moving theheat away from the heat source and the hot interface or area of thevapor chamber. The gas can then condense back into a liquid and releasethe latent heat. The liquid then returns to the hot interface or areathrough capillary action, centrifugal force, or gravity, at which pointthe cycle can repeat.

The type of liquid in the vapor chambers 810 can vary based on one ormore factors and/or considerations. As previously mentioned, in thecontext of autonomous vehicles (e.g., 102), the environmental conditionsand the conditions surrounding the ADSC 110 can vary and are often harshor extreme. Thus, the properties of the liquid implemented with thevapor chambers 810 can affect the performance of the liquid in the vaporchambers 810. For example, depending on various factors environmental,implementation, and surround factors and conditions, certain liquids canlead to poor heat transfer, clogging, corrosion, and even systemfailure, while other liquids may have better heat transfer performance,may not clog, may limit or avoid corrosion, and may reduce thelikelihood of system failure.

Thus, the type of liquid used in the vapor chambers 810 can be selectedbased on the properties of the liquid and the environmental,implementation, and surround conditions in which the vapor chambers 810operate. For example, the liquid can be selected based on the propertiesof the liquid and the temperature in which the vapor chambers 810 willoperate. Non-limiting examples of factors of a liquid that can beconsidered when selecting a liquid can include the liquid'scompatibility with the system's metals and/or the vapor chambers 810,the liquid's thermal conductivity and specific heat, the liquid'sviscosity, the liquid's freezing point, the liquid's flash point, theliquid's corrosivity, the liquid's toxicity, the liquid's thermalstability, etc. In some examples, the type of liquid selected can be aliquid determined to have compatibility with the system's metals and/orthe vapor chambers 810, high thermal conductivity and specific heat, lowviscosity, a low freezing point, a high flash point, low corrosivity,low toxicity, and/or thermal stability.

In some examples, the liquid used in the vapor chambers 810 can bewater. In other examples, the liquid used in the vapor chambers 810 canbe glycol. Moreover, non-limiting examples of other liquids can includede-ionized water, dielectric fluids, alcohol (e.g., methanol, ethanol,etc.), mercury, ammonia, water/glycol, Freon, alkali metals (e.g.,cesium, potassium, sodium), refrigerant R134a, etc. In some cases, thesame liquid can used in all of the vapor chambers 810. In other cases,different vapor chambers can have different types of liquids, which canvary or can be selected based on the one or more factors previouslyexplained.

In addition to having a working fluid, each of the vapor chambers 810can have a wick structure that can exert a capillary action on theliquid phase of the working fluid and a case (e.g., a sealed pipe orenvelope) which can house the wick structure, the working fluid, and anyother internal elements of the vapor chamber. The case and wickstructure can be designed to be compatible with the working fluid.Moreover, the materials used to construct the case and wick structurecan be selected based on some or all of the environmental,implementation, and surround factors previously described. Non-limitingexample materials that can be used for the case include copper,aluminum, superalloys, etc. Moreover, non-limiting examples of wickstructures include a sintered powder wick, a screen mesh wick, a groovedwick, etc.

Moreover, in some examples, the vapor chambers 810 can have internalposts, columns, rods or microchannels that help the fluid flow to adesired location (e.g., the different or colder interface or area)and/or direction. The internal posts, columns, or microchannels can alsoprovide support for the vapor chambers 810 to help prevent the structureof the vapor chambers 810 from collapsing due to pressure and/or otherforces.

In some examples, the configuration (e.g., size, length, shape,thickness, structure, etc.) of the case and wick can vary based on oneor more factors such as, for example, the type of working fluid, thecharacteristics (e.g., layout, size, shape, materials, etc.) of theenhanced cold plate 200, the layout of the computing components 202A-N,the desired heat carrying capacity of the vapor chambers 810, the typeand/or number of computing components 202A-N, the environmental andsurrounding conditions where the vapor chambers 810 will operate,performance requirements or factors associated with the computingcomponents 202A-N, and/or any other constraints that can influence theperformance, stability, cost, etc., of the vapor chambers 810.Similarly, in some examples, a configuration (e.g., the size, shape,thickness, number, arrangement, etc.) of internal posts, columns, rods,or microchannels in the vapor chambers 810 can vary based on the sameand/or other factors as described above.

In some examples, the configuration of the case, the wick, and/or theinternal posts, columns, rods, or microchannels can depend on anyconstrains created by the characteristics of the enhanced cold plate200, the layout of the computing components 202A-N, and/or a desiredQmax of the vapor chambers 810. The Qmax can be affected by variousfactors such as, for example, the diameter of the vapor chambers 810,the shape (e.g., flatness, roundness, curvature, amount of bending,etc.) of the vapor chambers 810, the size or length of the vaporchambers 810, the material of the casing of the vapor chambers 810, thematerial of the wick in the vapor chambers 810, the thickness of thewick, the porosity of the wick, the amount of working fluid, the type ofworking fluid, the configuration (e.g., number, size, shape, thickness,arrangement, etc.) of other internal structural elements (e.g., internalposts, columns, rods, or microchannels), etc. In some examples, the Qmaxof the vapor chambers 810 can be optimized or tuned for specificoperating parameters and performance characteristics by changing theconfiguration of internal components of the vapor chambers 810 (e.g.,wick porosity, wick thickness, etc.) and/or internal structural elements(e.g., internal posts, columns, rods, or microchannels) of the vaporchambers 810, the physical characteristics of the vapor chambers 810(e.g., the size, shape, bending, flattening, diameter, material orcomposition, etc.), the composition and/or materials of the vaporchambers 810, etc.

The number of vapor chambers 810 implemented in the enhanced cold plate200 can vary in different examples. The number of vapor chambers 810 canbe selected based on one or more factors such as, for example, thenumber and/or type of computing components 202A-N associated with theenhanced cold plate 200, the performance requirements of the ADSC 110and/or the computing components 202A-N, heat and power conditionsassociated with the ADSC 110 and computing components 202A-N, stabilityconsiderations associated with the ADSC 110 and computing components202A-N, the configuration (e.g., size, shape, thickness, length,structure, etc.) of the enhanced cold plate 200, environmental factors,the layout of the computing components 202A-N, the configuration of eachof the vapor chambers 810, the Qmax characteristics of the vaporchambers 810, etc. Moreover, the layout, arrangement, position, and/orshape of the vapor chambers 810 can also vary based on one or morefactors, as further described herein.

In some examples, one or more surfaces or sides of the vapor chambers810 can be flat or partly flat. Moreover, in some cases, one or more ofthe vapor chambers 810 can be horizontal vapor chambers. In other cases,one or more of the vapor chambers 810 can be vertical vapor chambers.Further, each of the vapor chambers 810 can dissipate or transfer heatin multiple dimensions or directions. In some examples, internal posts,rods, columns, or microchannels can help dissipate or transfer the heatin the multiple dimensions or directions.

As previously mentioned, in addition to including vapor chambers 810,the enhanced cold plate 200 can include a fluid channel 820 forremoving, transferring, dissipating, etc., heat away from the computingcomponents 202A-N. Moreover, the fluid channel 820 can also remove,transfer, dissipate, etc., heat transferred or collected from the vaporchambers 810, as further explained herein. The fluid channel 820 caninclude a fluid that can flow from a fluid ingress point 822A to a fluidegress point 822B. The fluid ingress point 822A and fluid egress point822B can include ports where the fluid enters and exits the fluidchannel 820, interfaces connecting the fluid channel 820 with tubes,hoses, or pipes that supply the fluid to the fluid channel 820 or pointswhere a tube, hose or pipe of the fluid channel 820 enters and exits theenhanced cold plate 200 from and to a different location on the ADSC 110(e.g., from and to a different enhanced cold plate, from and to areservoir, from and to a pump, etc.), etc.

The fluid in the fluid channel 820 can be the same type of fluid as theworking fluid in the vapor chambers 810 or a different type of fluid. Insome examples, the fluid in the fluid channel 820 can include water. Inother examples, the fluid in the fluid channel 820 can include glycol.In yet other examples, the fluid channel 820 can be used as a channelfor air instead of fluid. The air can be circulated through the fluidchannel 820 to transfer, remove, and/or dissipate heat.

The shape, configuration, layout and placement/positioning of the fluidchannel 820 and the vapor chambers 810 can vary in differentimplementations. In the example configuration 800 shown in FIG. 8, thevapor chambers 810 have a linear configuration and are coupled tocomputing components 202A and 202B. As shown, the vapor chamber 810A iscoupled to computing component 202A in order to transfer heat away fromthe computing component 202A, and the vapor chamber 810B is coupled tocomputing component 202B in order to transfer heat away from thecomputing component 202B. The computing components 202A and 202B in thisexample can be any of the computing components 202 previously described.For example, the computing components 202A and 202B can be CPUs, GPUs,or any other electronic computing component.

Further, the fluid channel 820 has a u-shape and surrounds the computingcomponents 202A-N. Thus, the fluid in the fluid channel 820 can flowfrom the fluid ingress point 822A, around the computing components202A-N, until exiting at the fluid egress point 822B. As the fluidtravels through the fluid channel 820, the fluid can absorb or collectheat from the computing components 202A-N and carry the heat away fromthe computing components 202A-N until exiting at the fluid egress point822B. Similarly, as the fluid travels by the vapor chambers 810A and810B, the fluid can absorb heat transferred or dissipated from the vaporchambers 810A and 810B, and transfer the heat away from the vaporchambers 810A and 810B until exiting at the fluid egress point 822B.This cycle can repeat as fluid continues to flow or circulate around thefluid channel 820, again exiting at the fluid egress point 822B. In thisway, the fluid channel 820 can enhance the cooling or thermal managementfeatures of the vapor chambers 810A and 810B, and vice versa.

In some cases, the fluid channel 820 can include, implement and/orcouple to one or more heat sinks. For example, one or more heat sinkscan be coupled to an internal or external surface of the fluid channel820. The one or more heat sinks can help dissipate heat collected by thefluid channel 820.

While FIG. 8 shows the fluid ingress point 822A located on an end of theenhanced cold plate 200 closer to the computing components 202A-Brelative to the fluid egress point 822B, and the fluid egress point 822Blocated on an end of the enhanced cold plate 200 that is closer to thevapor chambers 810 relative to the fluid ingress point 822A, it shouldbe noted that this arrangement is merely an example provided forexplanation purposes. In other examples, the fluid ingress point 822Aand/or the fluid egress point 822B can be located elsewhere in theenhanced cold plate 200.

For example, in some cases, the fluid ingress point 822A can be locatedwhere the fluid egress point 822B is currently shown in FIG. 8, and thefluid egress point 822B can be located where the fluid ingress point822A is currently shown in FIG. 8, such that their location is reversedand, as a result, the fluid in the fluid channel 820 flows in theopposite/reverse direction. In another example, the fluid ingress point822A and/or the fluid egress point 822B can be located on a differentside of the enhanced cold plate 200 than shown in FIG. 8 and/ordifferent sides of the enhanced cold plate 200 relative to each other.

FIG. 9 is a schematic diagram illustrating another example configuration900 of the enhanced cold plate 200 with the vapor chambers 810. In thisexample, the fluid channel 820 has a different shape as the u-shapeshown in FIG. 8. In particular, instead of continuing past an outer sideof computing component 202C (the side opposite to computing component202D), the fluid channel 820 turns before the computing component 202Cand goes around computing components 202C and 202D in a u-shape untilreturning to an outer side of computing component 202E (the sideopposite to computing components 202F and 202G). The fluid channel 820then continues along the u-shape trajectory as previously shown in FIG.8.

This layout of the fluid channel 820 can vary how heat is transferred orcollected from the computing components 202C and 202D. Moreover, thelayout of the fluid channel 820 can take into account specificconstraints or requirements regarding fluid channel coverage, availableor unobstructed space in the enhanced cold plate 200, thelayout/arrangement of components/objects on the enhanced cold plate 200(e.g., computing components 202A-N and/or any other objects orcomponents), thermal management requirements of the ADSC 110 and/or anyof the computing components 202A-N, heat transfer capabilities and/orperformance of the fluid channel 820 and/or the vapor chambers 810,and/or any other constraints or factors.

FIG. 10 is a schematic diagram illustrating another exampleconfiguration 1000 of the enhanced cold plate 200 and vapor chambers810. In this example, the locations of the fluid ingress point 822A andthe fluid egress point 822B are reversed with respect to their locationsshown in FIGS. 8 and 9. Consequently, the flow of fluid in the fluidchannel 820 is similarly reversed relative to the flow in FIGS. 8 and 9.

In addition, the arrangement of the computing components 202A-N haschanged so that computing component 202C is now partly across fromcomputing component 202A (as opposed to adjacent to computing component202B as shown in FIGS. 8 and 9) and computing component 202D is partlyacross from computing component 202B. To account for the differentarrangement of computing components 202C and 202D and/or providedifferent thermal management properties, the shape of the vapor chambers810 has also changed. Here, the vapor chambers 810 are shown with apartial bend or curve.

In particular, the vapor chambers 810A are now coupled at opposite endsto both computing components 202A and 202C. Given the arrangement of thecomputing components 202A and 202C, this coupling of the vapor chambers810A to both of the computing components 202A and 202C is enabled by thepartial bend or curve of the vapor chambers 810A. Moreover, thiscoupling of the vapor chambers 810A can allow the vapor chambers 810A totake heat away from both of the computing components 202A and 202C.

Similarly, the vapor chambers 810B are now coupled at opposite ends toboth computing components 202B and 202D. As previously explained, giventhe arrangement of the computing components 202B and 202D, this couplingof the vapor chambers 810B to both of the computing components 202A and202C is enabled by the partial bend or curve of the vapor chambers 810B.Moreover, this coupling of the vapor chambers 810B can allow the vaporchambers 810B to take heat away from both of the computing components202B and 202D.

As illustrated in FIG. 10, the shape of the vapor chambers 810 can varyto account for a specific arrangement of components on the enhanced coldplate 200. The direction of the flow of fluid in the fluid channel 820can also change as needed.

FIG. 11 is a schematic diagram illustrating another exampleconfiguration 1100 of the enhanced cold plate 200 including acombination of heat pipes 310 and a vapor chamber 810. Moreover, in theexample configuration 1100, the vapor chamber 810 has a different shape,size and arrangement than the vapor chambers 810A and 810B shown inFIGS. 8-10 arrangement.

In this example, the heat pipes 310 and the vapor chamber 810 have anL-shape and are arranged to form a rectangle or square. Moreover, theheat pipes 310 and the vapor chamber 810 surround the computingcomponents 202A-N such that the computing components 202A-N arecontained within the rectangle or square formed by the arrangement ofthe heat pipes 310 and the vapor chamber 810. The heat pipes 310 and thevapor chamber 810 can collect heat from the computing components 202A-Nand transfer the heat away from the computing components 202A-N toprovide cooling to the computing components 202A-N.

The enhanced cold plate 200 also includes a fluid channel 820 configuredin a u-shape surrounding the heat pipes 310, the vapor chamber 810 andthe computing components 202A-N. The fluid channel 820 can include fluidthat circulates from the fluid ingress point 822A, around the heat pipes310 and the vapor chamber 810 (and the computing components 202A-N),until exiting through the fluid egress point 822B. As the fluidcirculates around the fluid channel 820, the fluid can collect heat fromthe heat pipes 310 and the vapor chamber 810 and transfer the heat awayfrom the heat pipes 310 and the vapor chamber 810 (and the computingcomponents 202A-N) to provide further cooling of the computingcomponents 202A-N.

FIG. 12 is a schematic diagram illustrating another exampleconfiguration 1200 of the enhanced cold plate 200 including multipleheat pipes 310 and vapor chambers 810. In this example, the enhancedcold plate 200 includes two sets of heat pipes 310A-B arranged parallelor adjacent to computing components 202D, 202E, 202F and 202N. Each ofthe sets of heat pipes 310A-B can include one or more heat pipes.Moreover, the sets of heat pipes 310A-B can dissipate heat away from thecomputing components 202D, 202E, 202F, and 202N.

The enhanced cold plate 200 also includes a vapor chamber 810A coupledto computing components 202A and 202C on opposite ends, and a vaporchamber 810B coupled to computing components 202B and 202C on oppositeends. The vapor chambers 810A-B can help dissipate and/or transfer heataway from the computing components 202A-C.

The enhanced cold plate 200 also includes a vapor chamber 810C embedded,contained, or implemented within a fluid channel 820. The vapor chamber810C can help dissipate and/or transfer heat away from the computingcomponents 202A-N. Moreover, fluid in the fluid channel 820 can collectheat from the vapor chamber 810C and dissipate and/or transfer the heataway. In some examples, the fluid in the fluid channel 820 can also helpdissipate and/or transfer heat away from the computing components202A-N.

The fluid channel 820 in this example has a linear shape and is locatedon an end of the enhanced cold plate 200. Fluid in the fluid channel 820can circulate from a fluid ingress point 822A and around the vaporchamber 810C until exiting at a fluid egress point 822B. In someexamples, the fluid in the fluid channel 820 can surround or engulf thevapor chamber 810B in the fluid channel 820. In some cases, the fluidchannel 820 can include heat sinks 1202, which can help dissipate heatfrom the vapor chamber 810C and/or the computing components 202A-N. Insome examples, the fluid channel 820 can include a single heat sink forenhancing thermal management benefits. In other examples, the fluidchannel 820 can include multiple heat sinks.

In some cases, the heat sinks 1202 can be coupled to an exterior surfaceof the fluid channel 820 and/or the enhanced cold plate 200. In otherexamples, the heat sinks 1202 can be enclosed within the fluid channel820. Moreover, in some cases, the heat sinks 1202 can be directly orindirectly coupled to the vapor chamber 810C in the fluid channel 820.For example, the heat sinks 1202 can be coupled to, and/or in contactwith, different portions of the vapor chamber 810C.

In some examples, the sets of heat pipes 310A can dissipate heat awayfrom the computing components 202A-C. The dissipated heat (as well asheat from the other computing components 202D-N) can move towards thevapor chamber 810C and the fluid channel 820. The vapor chamber 810C cancollect the heat to transfer the heat away from the computing components202A-N. The fluid in the fluid channel 820 and the heat sinks 1202 canthen further help dissipate and/or transfer the heat away from thecomputing components 202A-N and/or the vapor chamber 810C.

While the fluid channel 820 and the vapor chamber 810C in the fluidchannel 820 are shown in FIG. 12 in a linear configuration/shape, itshould be noted that such configuration/shape is provided herein as anexample for explanation purposes. In other examples, the enhanced coldplate 200 can implement one or more fluid channels containing or housingone or more vapor chambers, and the one or more fluid channels and/orthe one or more vapor chambers contained or housed in the one or morefluid channels can have a different size, shape, arrangement,configuration, etc.

Moreover, in some examples, the enhanced cold plate 200 shown in FIGS.8-12 can have other cooling components or combinations of coolingcomponents than those shown in FIGS. 8-12. For example, in some cases,the enhanced cold plate 200 can include a fan in combination with one ormore vapor chambers and/or heat pipes.

FIG. 13A is a diagram illustrating an example heat management flow 1300in an enhanced cold plate 200 implemented by the ADSC 110 and having anexample configuration. In this example, a heat source 1306 on theenhanced cold plate 200 first generates and emits heat 1304. The heatsource 1306 can include one or more of the computing components 202A-Npreviously described.

A heat management component 1310 implemented by the enhanced cold plate200 can collect the heat 1304 and dissipate and/or transfer the heat1304 away from the heat source 1306 and towards the fluid channel 320implemented by the enhanced cold plate 200. The heat managementcomponent 1310 can include, for example, a heat pipe (e.g., 310) or avapor chamber (e.g., 810).

The fluid channel 320 can collect and/or absorb the heat 1304 dissipatedand/or transferred by the heat management component 1310, and dissipateand/or transfer the heat 1304 through a fluid 1302 that circulatesaround the fluid channel 320. The fluid 1302 can circulate around thefluid channel 320 in various cycles, while collecting, absorbing,dissipating, and/or transferring heat in each cycle.

FIG. 13B is a diagram illustrating another example heat management flow1350 in an enhanced cold plate 200 implemented by the ADSC 110 andhaving a different example configuration than the enhanced cold plate200 shown in FIG. 13A. In this example, the heat source 1306 similarlyemits heat 1304, which can be collected and/or absorbed by the heatmanagement component 1310 and dissipated and/or transferred by the heatmanagement component 1310 away from the heat source 1306 and towards afluid channel 320 containing another heat management component 1360.

The heat management component 1360 in the fluid channel 320 can includea heat pipe (e.g., 310) or a vapor chamber (e.g., 810). The heatmanagement component 1360 can be adjacent to, surrounded by, or engulfedby fluid 1302 in the fluid channel 320. The fluid 1302 in the fluidchannel 320 and/or the heat management component 1360 in the fluidchannel 320 can collect and/or absorb the heat 1304 from the heatmanagement component 1310. Moreover, the fluid 1302 and/or the heatmanagement component 1360 can transfer the heat 1304 to heat sinks 1362,which can dissipate the heat received by the heat sinks 1362. In someexamples, the fluid 1302 can also transfer at least some of the heat1304 out of the enhanced cold plate 200 when it exits the enhanced coldplate 200 through a fluid egress point (e.g., 322B, 822B).

While the heat management component 1310 (FIG. 13A) or 1360 (FIG. 13B)is shown as a single component, it should be understood that, in otherexamples, the heat management component 1310 or 1360 can includemultiple components. For example, in some cases, the heat managementcomponent 1310 or 1360 can include one or more heat pipes and/or one ormore vapor chambers.

Having disclosed some example system components and concepts, thedisclosure now turns to FIGS. 14 and 15, which illustrate examplemethods 1400 and 1500 for thermal management in automated driving systemcomputers. The steps outlined herein are exemplary and can beimplemented in any combination thereof, including combinations thatexclude, add, or modify certain steps.

At block 1402, the method 1400 can include transferring, via a firstworking fluid in one or more heat pipes (e.g., 310) coupled to orembedded in one or more cold plates (e.g., 200) on an ADSC (e.g., 110),heat away from one or more processors (e.g., 202A, 202B, 202C, 202D,202F, 202G, and/or 202N) in the ADSC. In some cases, the one or moreheat pipes can include a single heat pipe. In other cases, the one ormore heat pipes can include a plurality of heat pipes.

Moreover, in some examples, the one or more heat pipes can be coupled tothe one or more cold plates. In other examples, the one or more heatpipes can be embedded in (or within) the one or more cold plates. Forexample, the one or more heat pipes can be embedded in or within the oneor more cold plates.

In some cases, the one or more heat pipes can be coupled to the one ormore processors, and the one or more fluid channels can be embedded inthe one or more cold plates and can run through an inside portion of theone or more cold plates.

In some examples, the ADSC can be coupled to an autonomous vehicle(e.g., 102) and configured to perform one or more operations of theautonomous vehicle. Moreover, the ADSC can be housed in and/orimplemented by the autonomous vehicle, as further described above withrespect to FIG. 1.

In some examples, the one or more cold plates can also include one ormore vapor chambers (e.g., 810) coupled to or embedded in the one ormore cold plates and configured to collect heat from the one or moreprocessors and/or one or more electronic components (e.g., 202A, 202B,202C, 202D, 202F, 202G, and/or 202N), and transfer the heat away fromthe one or more processors and/or the one or more electronic componentsvia a third working fluid in the one or more vapor chambers.

At block 1404, the method 1400 can include collecting, from the one ormore heat pipes and via one or more fluid channels (e.g., 320) in theone or more cold plates, a portion of the heat transferred away from theone or more processors. In some examples, the one or more fluid channelscan be configured to circulate a second working fluid from a respectivefluid ingress point (e.g., 322A) to a respective fluid egress point(e.g., 322B). The second working fluid in the one or more fluid channelscan dissipate the portion of the heat, remove the portion of the heat,and/or transfer the portion of the heat away and/or towards anotherlocation such as a colder location.

In some examples, the one or more fluid channels can be configured tocollect heat from the one or more processors and/or the one or more heatpipes and transfer the heat away from the one or more processors and/orthe one or more heat pipes.

At block 1406, the method 1400 can include removing the portion of theheat via the second working fluid in the one or more fluid channels. Insome examples, removing the portion of the heat via the second workingfluid in the one or more fluid channels can include dissipating theportion of the heat via the second working fluid in the one or morefluid channels, one or more additional heat pipes contained in the oneor more fluid channels, and/or one or more heat sinks associated with(e.g., coupled to or contained within) the one or more fluid channels.

In some aspects, the method 1400 can include collecting, via at leastone of the one or more heat pipes, heat from one or more electroniccomponents (e.g., 202A, 202B, 202C, 202D, 202F, 202G, and/or 202N) inthe ADSC to yield a portion of collected heat, and transferring theportion of collected heat away from the one or more electroniccomponents via the at least one of the one or more heat pipes. In someaspects, the method 1400 can further include collecting the portion ofcollected heat via the one or more fluid channels, and dissipating theportion of collected heat via the second working fluid in the one ormore fluid channels and/or one or more heat sinks implemented with theone or more fluid channels.

In some examples, the one or more electronic components can include acircuit board, a memory, a field-programmable gate array, anapplication-specific integrated circuit, a storage device, asystem-on-chip, and/or power electronics. Moreover, in some examples,the one or more processors can include a central processing unit, agraphics processing unit, and/or a digital signal processor.

In some aspects, the method 1400 can include collecting, via one or moreadditional heat pipes contained within the one or more fluid channels,at least part of the heat transferred away from the one or moreprocessors to yield a portion of collected heat, and transferring theportion of collected heat via the second working fluid in the one ormore fluid channels. In some examples, transferring the portion ofcollected heat via the second working fluid in the one or more fluidchannels can include dissipating at least some of the portion ofcollected heat via one or more heat sinks (e.g., 702) coupled to the oneor more fluid channels and/or the one or more additional heat pipescontained within the one or more fluid channels.

FIG. 15 illustrates another example method 1500 for thermal managementin automated driving system computers. At block 1502, the method 1500can include transferring, via a first working fluid in one or more vaporchambers (e.g., 810) coupled to or embedded in one or more cold plates(e.g., 200) on an ADSC (e.g., 110), heat away from one or moreprocessors (e.g., 202A, 202B, 202C, 202D, 202F, 202G, and/or 202N) inthe ADSC. In some cases, the one or more vapor chambers can include asingle vapor chamber. In other cases, the one or more vapor chambers caninclude a plurality of vapor chambers.

Moreover, in some examples, the one or more vapor chambers can becoupled to the one or more cold plates. In other examples, the one ormore vapor chambers can be embedded in (or within) the one or more coldplates. For example, the one or more vapor chambers can be embedded inor within the one or more cold plates.

In some cases, the one or more vapor chambers can be coupled to the oneor more processors, and the one or more fluid channels can be embeddedin the one or more cold plates and can run through an inside portion ofthe one or more cold plates.

In some examples, the ADSC can be coupled to an autonomous vehicle(e.g., 102) and configured to perform one or more operations of theautonomous vehicle. Moreover, the ADSC can be housed in and/orimplemented by the autonomous vehicle, as further described above withrespect to FIG. 1.

In some examples, the one or more cold plates can also include one ormore heat pipes (e.g., 310) coupled to or embedded in the one or morecold plates and configured to collect heat from the one or moreprocessors and/or one or more electronic components (e.g., 202A, 202B,202C, 202D, 202F, 202G, and/or 202N), and transfer the heat away fromthe one or more processors and/or the one or more electronic componentsvia a third working fluid in the one or more heat pipes.

At block 1504, the method 1500 can include collecting, from the one ormore vapor chambers and via one or more fluid channels (e.g., 320) inthe one or more cold plates, a portion of the heat transferred away fromthe one or more processors. In some examples, the one or more fluidchannels can be configured to circulate a second working fluid from arespective fluid ingress point (e.g., 822A) to a respective fluid egresspoint (e.g., 822B). The second working fluid in the one or more fluidchannels can dissipate the portion of the heat, remove the portion ofthe heat, and/or transfer the portion of the heat away and/or towardsanother location such as a colder location.

In some examples, the one or more fluid channels can be configured tocollect heat from the one or more processors and/or the one or morevapor chambers and transfer the heat away from the one or moreprocessors and/or the one or more vapor chambers.

At block 1506, the method 1500 can include removing the portion of theheat via the second working fluid in the one or more fluid channels. Insome examples, removing the portion of the heat via the second workingfluid in the one or more fluid channels can include dissipating theportion of the heat via the second working fluid in the one or morefluid channels, one or more additional vapor chambers contained in theone or more fluid channels, and/or one or more heat sinks associatedwith (e.g., coupled to or contained within) the one or more fluidchannels.

In some aspects, the method 1500 can include collecting, via at leastone of the one or more vapor chambers, heat from one or more electroniccomponents (e.g., 202A, 202B, 202C, 202D, 202F, 202G, and/or 202N) inthe ADSC to yield a portion of collected heat, and transferring theportion of collected heat away from the one or more electroniccomponents via the at least one of the one or more vapor chambers. Insome aspects, the method 1500 can further include collecting the portionof collected heat via the one or more fluid channels, and dissipatingthe portion of collected heat via the second working fluid in the one ormore fluid channels and/or one or more heat sinks implemented with theone or more fluid channels.

In some examples, the one or more electronic components can include acircuit board, a memory, a field-programmable gate array, anapplication-specific integrated circuit, a storage device, asystem-on-chip, and/or power electronics. Moreover, in some examples,the one or more processors can include a central processing unit, agraphics processing unit, and/or a digital signal processor.

In some aspects, the method 1500 can include collecting, via one or moreadditional vapor chambers contained within the one or more fluidchannels, at least part of the heat transferred away from the one ormore processors to yield a portion of collected heat, and transferringthe portion of collected heat via the second working fluid in the one ormore fluid channels. In some examples, transferring the portion ofcollected heat via the second working fluid in the one or more fluidchannels can include dissipating at least some of the portion ofcollected heat via one or more heat sinks (e.g., 1202) coupled to theone or more fluid channels and/or the one or more additional vaporchambers contained within the one or more fluid channels.

As described herein, one aspect of the present technology includesgathering and using data available from various sources to improvequality and experience. The present disclosure contemplates that in someinstances, this gathered data may include personal information. Thepresent disclosure contemplates that the entities involved with suchpersonal information respect and value privacy policies and practices.

FIG. 16 illustrates an example computing system 1600 which can be, forexample, any computing device making up ADSC 110, remote computingsystem 150, a passenger device executing rideshare application 170, orany other computing device. In FIG. 16, the components of the computingsystem 1600 are in communication with each other using connection 1605.Connection 1605 can be a physical connection via a bus, or a directconnection into processor 1610, such as in a chipset architecture.Connection 1605 can also be a virtual connection, networked connection,or logical connection.

In some embodiments, computing system 1600 is a distributed system inwhich the functions described in this disclosure can be distributedwithin a datacenter, multiple data centers, a peer network, etc. In someembodiments, one or more of the described system components representsmany such components each performing some or all of the function forwhich the component is described. In some embodiments, the componentscan be physical or virtual devices.

Example system 1600 includes at least one processing unit (CPU orprocessor) 1610 and connection 1605 that couples various systemcomponents including system memory 1615, such as read-only memory (ROM)1620 and random access memory (RAM) 1625 to processor 1610. Computingsystem 1600 can include a cache of high-speed memory 1612 connecteddirectly with, in close proximity to, or integrated as part of processor1610.

Processor 1610 can include any general purpose processor and a hardwareservice or software service, such as services 1632, 1634, and 1636stored in storage device 1630, configured to control processor 1610 aswell as a special-purpose processor where software instructions areincorporated into the actual processor design. Processor 1610 mayessentially be a completely self-contained computing system, containingmultiple cores or processors, a bus, memory controller, cache, etc. Amulti-core processor may be symmetric or asymmetric.

To enable user interaction, computing system 1600 includes an inputdevice 1645, which can represent any number of input mechanisms, such asa microphone for speech, a touch-sensitive screen for gesture orgraphical input, keyboard, mouse, motion input, speech, etc. Computingsystem 1600 can also include output device 1635, which can be one ormore of a number of output mechanisms known to those of skill in theart. In some instances, multimodal systems can enable a user to providemultiple types of input/output to communicate with computing system1600. Computing system 1600 can include communications interface 1640,which can generally govern and manage the user input and system output.There is no restriction on operating on any particular hardwarearrangement, and therefore the basic features here may easily besubstituted for improved hardware or firmware arrangements as they aredeveloped.

Storage device 1630 can be a non-volatile memory device and can be ahard disk or other types of computer readable media which can store datathat are accessible by a computer, such as magnetic cassettes, flashmemory cards, solid state memory devices, digital versatile disks,cartridges, random access memories (RAMs), read-only memory (ROM),and/or some combination of these devices.

The storage device 1630 can include software services, servers,services, etc., that when the code that defines such software isexecuted by the processor 1610, it causes the system to perform afunction. In some embodiments, a hardware service that performs aparticular function can include the software component stored in acomputer-readable medium in connection with the necessary hardwarecomponents, such as processor 1610, connection 1605, output device 1635,etc., to carry out the function.

For clarity of explanation, in some instances, the present technologymay be presented as including individual functional blocks includingfunctional blocks comprising devices, device components, steps orroutines in a method embodied in software, or combinations of hardwareand software.

Any of the steps, operations, functions, or processes described hereinmay be performed or implemented by a combination of hardware andsoftware services or services, alone or in combination with otherdevices. In some embodiments, a service can be software that resides inmemory of a client device and/or one or more servers of a contentmanagement system and perform one or more functions when a processorexecutes the software associated with the service. In some embodiments,a service is a program or a collection of programs that carry out aspecific function. In some embodiments, a service can be considered aserver. The memory can be a non-transitory computer-readable medium.

In some embodiments, the computer-readable storage devices, mediums, andmemories can include a cable or wireless signal containing a bit streamand the like. However, when mentioned, non-transitory computer-readablestorage media expressly exclude media such as energy, carrier signals,electromagnetic waves, and signals per se.

Methods according to the above-described examples can be implementedusing computer-executable instructions that are stored or otherwiseavailable from computer-readable media. Such instructions can comprise,for example, instructions and data which cause or otherwise configure ageneral purpose computer, special purpose computer, or special purposeprocessing device to perform a certain function or group of functions.Portions of computer resources used can be accessible over a network.The executable computer instructions may be, for example, binaries,intermediate format instructions such as assembly language, firmware, orsource code. Examples of computer-readable media that may be used tostore instructions, information used, and/or information created duringmethods according to described examples include magnetic or opticaldisks, solid-state memory devices, flash memory, USB devices providedwith non-volatile memory, networked storage devices, and so on.

Devices implementing methods according to these disclosures can comprisehardware, firmware and/or software, and can take any of a variety ofform factors. Typical examples of such form factors include servers,laptops, smartphones, small form factor personal computers, personaldigital assistants, and so on. The functionality described herein alsocan be embodied in peripherals or add-in cards. Such functionality canalso be implemented on a circuit board among different chips ordifferent processes executing in a single device, by way of furtherexample.

The instructions, media for conveying such instructions, computingresources for executing them, and other structures for supporting suchcomputing resources are means for providing the functions described inthese disclosures.

Although a variety of examples and other information was used to explainaspects within the scope of the appended claims, no limitation of theclaims should be implied based on particular features or arrangements insuch examples, as one of ordinary skill would be able to use theseexamples to derive a wide variety of implementations. Further andalthough some subject matter may have been described in languagespecific to examples of structural features and/or method steps, it isto be understood that the subject matter defined in the appended claimsis not necessarily limited to these described features or acts. Forexample, such functionality can be distributed differently or performedin components other than those identified herein. Rather, the describedfeatures and steps are disclosed as examples of components of systemsand methods within the scope of the appended claims.

Claim language reciting “at least one of” a set indicates that onemember of the set or multiple members of the set satisfy the claim. Forexample, claim language reciting “at least one of A and B” means A, B,or A and B.

What is claimed is:
 1. A computer system associated with an autonomousvehicle, the computer system comprising: one or more cold platescomprising one or more fluid channels, each of the one or more fluidchannels being configured to circulate a first working fluid from arespective fluid ingress point to a respective fluid egress point; aplurality of computing components coupled to the one or more coldplates, wherein one or more of the plurality of computing componentscomprise one or more processors; a plurality of heat pipes coupled to orembedded in the one or more cold plates and configured to collect afirst portion of heat from a first portion of the plurality of computingcomponents and transfer the first portion of the heat away from thefirst portion of the plurality of computing components via a secondworking fluid in the one or more heat pipes, wherein at least a firstheat pipe from the plurality of heat pipes runs adjacent to at least asecond heat pipe from the plurality of heat pipes; one or more vaporchambers coupled to or embedded in the one or more cold plates andconfigured to collect a second portion of the heat from a second portionof the plurality of computing components and transfer the second portionof the heat away from the second portion of the plurality of computingcomponents via a third working fluid in the one or more vapor chambers,each of the one or more vapor chambers including internal posts,columns, or microchannels configured to provide support for each of theone or more vapor chambers to reduce a likelihood of the one or morevapor chambers collapsing; and a chassis housing the one or more coldplates, the plurality of computing components, the one or more vaporchambers, and the plurality of heat pipes.
 2. The computer system ofclaim 1, further comprising one or more additional heat pipes or one ormore additional vapor chambers contained within the one or more fluidchannels.
 3. The computer system of claim 2, further comprising one ormore heat sinks coupled to at least one of (i) the one or more fluidchannels and (ii) the one or more additional heat pipes or the one ormore additional vapor chambers.
 4. The computer system of claim 1,wherein the plurality of computing components further comprises one ormore electronic components, the one or more electronic componentscomprising at least one of a controller, a circuit board, a memory, afield-programmable gate array, an application-specific integratedcircuit, a storage device, a system-on-chip, and power electronics. 5.The computer system of claim 4, wherein the one or more electroniccomponents is coupled to the one or more cold plates.
 6. The computersystem of claim 5, wherein at least one of the plurality of heat pipesis configured to collect a third portion of the heat generated by theone or more electronic components and transfer the third portion of theheat away from the one or more electronic components via the secondworking fluid.
 7. The computer system of claim 5, wherein the one ormore vapor chambers is configured to collect a third portion of the heatgenerated by the one or more electronic components and transfer thethird portion of the heat away from the one or more electroniccomponents via the third working fluid.
 8. The computer system of claim1, wherein the one or more processors comprise at least one of a centralprocessing unit, a graphics processing unit, and a digital signalprocessor, and wherein the one or more fluid channels is configured tocollect the first or second portions of the heat from at least one of(i) the one or more processors and (ii) one or more of the plurality ofheat pipes and/or the one or more vapor chambers and transfer the firstor second portions of the heat away from the at least one of (i) the oneor more processors and (ii) the one or more of the plurality of heatpipes and/or the one or more vapor chambers.
 9. The computer system ofclaim 1, wherein the one or more fluid channels is embedded in the oneor more cold plates and run through an inside portion of the one or morecold plates.
 10. The computer system of claim 1, wherein the computersystem is coupled to the autonomous vehicle and configured to performone or more operations of the autonomous vehicle.
 11. A methodcomprising: collecting, via a first working fluid in a plurality of heatpipes coupled to or embedded in one or more cold plates on a computersystem of an autonomous vehicle (AV), a first portion of heat from aplurality of computing components coupled to the one or more coldplates, wherein one or more of the plurality of computing componentscomprise one or more processors, wherein the one or more cold platescomprise one or more fluid channels, each of the one or more fluidchannels being configured to circulate a second working fluid from arespective fluid ingress point to a respective fluid egress point;transferring, via the first working fluid in the plurality of heatpipes, the first portion of the heat away from the plurality ofcomputing components; collecting, via a third working fluid in one ormore vapor chambers coupled to or embedded in the one or more coldplates, a second portion of the heat from a second portion of theplurality of computing components, each of the one or more vaporchambers including internal posts, columns, or microchannels configuredto provide support for each of the one or more vapor chambers to reducea likelihood of the one or more vapor chambers collapsing; andtransferring, via the third working fluid in the one or more vaporchambers, the second portion of the heat from the second portion of theplurality of computing components, wherein the computer system comprisesa chassis housing the one or more cold plates, the plurality ofcomputing components, the one or more vapor chambers, and the pluralityof heat pipes.
 12. The method of claim 11, further comprising:collecting, via one or more phase change elements contained within theone or more fluid channels, at least a part of the heat transferred awayfrom the plurality of computing components to yield collected heat; andtransferring the collected heat via the second working fluid in the oneor more fluid channels, wherein the one or more phase change elementsinclude at least one of (i) one or more additional heat pipes and (ii)one or more additional vapor chambers.
 13. The method of claim 12,wherein the transferring the collected heat via the second working fluidin the one or more fluid channels comprises: dissipating the collectedheat via one or more heat sinks coupled to at least one of (i) the oneor more fluid channels and (ii) the one or more phase change elements.14. The method of claim 11, wherein the plurality of computingcomponents further comprises one or more electronic components, the oneor more electronic components comprising at least one of a controller, acircuit board, a memory, a field-programmable gate array, anapplication-specific integrated circuit, a storage device, asystem-on-chip, and power electronics.
 15. The method of claim 14,wherein the one or more electronic components is coupled to the one ormore cold plates.
 16. The method of claim 15, further comprising:collecting, via (i) at least one of the plurality of heat pipes or (ii)at least one of the one or more vapor chambers, a third portion of heatfrom the one or more electronic components; and transferring the thirdportion of the heat away from the one or more electronic components via(i) the at least one of the plurality of heat pipes or (ii) the at leastone of the one or more vapor chambers.
 17. The method of claim 11,further comprising: collecting, via the one or more fluid channels, atleast a portion of the heat generated by one or more of the plurality ofcomputing components; and dissipating, via at least one of (i) thesecond working fluid in the one or more fluid channels and (ii) one ormore heat sinks associated with the one or more fluid channels, the atleast the portion of the heat generated by the one or more of theplurality of computing components.
 18. The method of claim 11, whereinthe one or more processors comprise at least one of a central processingunit, a graphics processing unit, and a digital signal processor, andwherein the one or more fluid channels is configured to collect at leasta portion of the heat from at least one of (i) the one or moreprocessors, (ii) the one or more vapor chambers, and (iii) the pluralityof heat pipes and transfer the at least the portion of the heat awayfrom the at least one of (i) the one or more processors, (ii) the one ormore vapor chambers, and (iii) the plurality of heat pipes to the secondworking fluid.
 19. The method of claim 11, wherein transferring thefirst portion of the heat via the first working fluid or the secondportion of the heat via the third working fluid comprises dissipatingthe first portion of the heat or the second portion of the heat via atleast one of (i) the second working fluid in the one or more fluidchannels, (ii) at least one of one or more additional heat pipes and oneor more additional vapor chambers contained in the one or more fluidchannels, and (iii) one or more heat sinks associated with the one ormore fluid channels.
 20. The method of claim 11, wherein at least one of(i) at least a portion of the plurality of heat pipes and (ii) at leasta portion of the one or more vapor chambers is coupled to the one ormore processors, wherein the one or more fluid channels is embedded inthe one or more cold plates and run through an inside portion of the oneor more cold plates.